The UC8176 and UC8179 chips that exist in tree have subtly different
register layouts. Use separate compatible strings for these chips and
a quirks structure that describe device-specific behavior.
Signed-off-by: Andreas Sandberg <andreas@sandberg.uk>
The GD7965 driver is really just a vendor name for the UltraChip
UC8179. Rename the driver to UC81xx since there are other chips in the
family (e.g., the UC8176) with an almost identical register interface.
Signed-off-by: Andreas Sandberg <andreas@sandberg.uk>
Kconfig will default to enable the drivers based on devicetree so
we don't need to explicitly set the Kconfig symbols.
Signed-off-by: Kumar Gala <galak@kernel.org>
Remove the support for enabling passthrough mode support for MPU9150
on the AK8975. We don't have a proper MPU9150 driver and the MPU9150
has been EOL. So its highly unlikely this code is being used.
Additonally we remove the device tree binding for the MPU9150 since
we don't have a proper driver for it.
Signed-off-by: Kumar Gala <galak@kernel.org>
Remove mt9m114 from dtsi is a video driver and not a sensor. The
sensor build_all test didn't actually build this driver and we have
coverage now from the video build_all test for it.
Signed-off-by: Kumar Gala <galak@kernel.org>
This commit adds the necessary changes to build w1-devices using
the vnd,w1 dummy driver in the build_all test case.
Additionally, definitions for the ds18b20 1-wire temperature sensor
are added.
Signed-off-by: Thomas Stranger <thomas.stranger@outlook.com>
Unify the CAN controller configuration done in Zephyr devicetrees:
- Specify a resynchronization jump width (sjw) of 1 time quanta in SoC
devicetrees as this is the most common. Boards can override this if
needed.
- Specify a sample point of 87.5% as recommended by CAN in Automation
(CiA) in SoC devicetrees. Boards can override this if needed.
- Specify a bus speed of 125 kbits/second (arbitration phase) and 1
Mbits/second (CAN-FD data phase) in board devicetrees as this is what
is used by all Zephyr CAN samples.
Signed-off-by: Henrik Brix Andersen <hebad@vestas.com>
This commit implements the temperature sensor interface for
the Maxim MAX31875Low-Power I2C Temperature Sensor.
Signed-off-by: Pete Dietl <petedietl@gmail.com>
Remove the custom GPIO driver instantiation for `vnd,gpio` compatibles
in "build_all" tests. The devices are now instantiated in `gpio_test.c`.
Signed-off-by: Jordan Yates <jordan.yates@data61.csiro.au>
Remove the requirement for specifying #address-cells and #size-cells
properties for CAN controller devicetree nodes.
CAN controllers do not have a common concept of devicetree child nodes
and thus have no need for these properties. This is in line with
upstream Linux kernel devicetree bindings.
Signed-off-by: Henrik Brix Andersen <hebad@vestas.com>
Adding support for the TI TMP108 temperature sensor. This includes
over/under temp interrupt support as well as one shot, continuous
conversion and power down modes.
Signed-off-by: Jimmy Johnson <catch22@fastmail.net>
Create an explicit ina230 driver which is supposed to
work with 230 and 231 variants. While at it switch
to i2c_dt_spec helpers and change device-tree node
names to use - instead of _ in order to follow
convention.
Signed-off-by: Bartosz Bilas <b.bilas@grinn-global.com>
Adds another test configuration to ensure we build sensor drivers with
device power management enabled, in addition to the existing test that
builds sensor drivers with device power management disabled.
Signed-off-by: Maureen Helm <maureen.helm@intel.com>
Remove CC1200 and CC2520 devicetree nodes from the test as they are not
sensors and are not being built by this test regardless.
Signed-off-by: Jordan Yates <jordan.yates@data61.csiro.au>
This adds basic support for the Silabs Si7210 hall effect magnetic
position and temperature sensor. It is able to get magnetic field and
temperature in the default scale of the sensor (depending on the
variant). It also supports going into sleep mode without measurements
through the device power management infrastructure.
It is most notably missing support for scale change, measurement
averaging and filtering, and alert pin configuration (threshold,
hysteris, tamper).
Signed-off-by: Aurelien Jarno <aurelien@aurel32.net>
Move to CMake 3.20.0.
At the Toolchain WG it was decided to move to CMake 3.20.0.
The main reason for increasing CMake version is better toolchain
support.
Better toolchain support is added in the following CMake versions:
- armclang, CMake 3.15
- Intel oneAPI, CMake 3.20
- IAR, CMake 3.15 and 3.20
Signed-off-by: Torsten Rasmussen <Torsten.Rasmussen@nordicsemi.no>
I can't find any reference anywhere showing that the manufacturer of
the LPD8803 or LPD8806 LED scripts is a company called 'colorway'.
Use 'greeled' instead; these seem to actually be manufactured by
GreeLed corporation.
Signed-off-by: Martí Bolívar <marti.bolivar@nordicsemi.no>
It should be "maxim,max30101", because the vendor prefix for this
company is "maxim", not "max".
Signed-off-by: Martí Bolívar <marti.bolivar@nordicsemi.no>
This driver supports the TI INA230 and INA231 Bidirectional Current
and Power Monitors. The devices work on the I2C interface and are
created from DT nodes with a compatible property matching "ti,ina23x".
The following datasheets were referenced while developing the driver:
https://www.ti.com/product/INA230https://www.ti.com/product/INA231
Twister passed:
twister -T tests/drivers/build_all/sensor/
Testing was performed on the stm32g071b_disco board with the following:
Load: ~170 ohms
Voltage: 5V
Measured Values:
Voltage: 5.1 V
Current: 0.032 A
Power: 0.157 W
Signed-off-by: Sam Hurst <sbh1187@gmail.com>
Some devices compatibles with the WS2812 IC have a different channel to
color mappings (e.g. RGB, BGR, RGBW, etc).
This patch introduces the "color-mapping" required property for the
WS2812 DT binding and adds support to the ws2812_gpio and ws2812_spi
drivers. This new property allows to configure the color to channel
mapping of a WS2812 compatible LED strip controller from its DT node.
Since this property also allows to know if a white channel is available,
then this patch removes the "has-white-channel" property.
Signed-off-by: Simon Guinot <simon.guinot@seagate.com>
Enable serial driver such that sensors commuicating via uart
can be added to this test(using the vnd,serial driver).
Signed-off-by: Thomas Stranger <thomas.stranger@outlook.com>
Include the TI HDC2010, HDC2021, HDC2022 and HDC2080 temperature and
humidity sensors in the build_all test, to test the TI_HDC20XX driver.
Signed-off-by: Aurelien Jarno <aurelien@aurel32.net>
Now that we only build on native_posix, we can build all the sensors
together in one pass. This makes it easier to manage the conf files
going forward.
Signed-off-by: Kumar Gala <kumar.gala@linaro.org>
The driver build_all tests only need to build a driver once and
so limit the sensor tests to only build on native_posix.
We tweak CONFIG_SYS_CLOCK_TICKS_PER_SEC as part of this change as
hp206c requires this setting to build.
Signed-off-by: Kumar Gala <kumar.gala@linaro.org>
Add the I2C version of the MS5607 (the SPI version was already enabled)
so that it gets compiled tested.
Signed-off-by: Aurelien Jarno <aurelien@aurel32.net>
Enable building the LMP90xxx driver (move devicetree nodes over from the
sensors/spi.dtsi). Limit to building on a single platform as this
is just making sure the drivers compile.
Signed-off-by: Kumar Gala <kumar.gala@linaro.org>
