Create an explicit ina230 driver which is supposed to
work with 230 and 231 variants. While at it switch
to i2c_dt_spec helpers and change device-tree node
names to use - instead of _ in order to follow
convention.
Signed-off-by: Bartosz Bilas <b.bilas@grinn-global.com>
Adds another test configuration to ensure we build sensor drivers with
device power management enabled, in addition to the existing test that
builds sensor drivers with device power management disabled.
Signed-off-by: Maureen Helm <maureen.helm@intel.com>
Remove CC1200 and CC2520 devicetree nodes from the test as they are not
sensors and are not being built by this test regardless.
Signed-off-by: Jordan Yates <jordan.yates@data61.csiro.au>
This adds basic support for the Silabs Si7210 hall effect magnetic
position and temperature sensor. It is able to get magnetic field and
temperature in the default scale of the sensor (depending on the
variant). It also supports going into sleep mode without measurements
through the device power management infrastructure.
It is most notably missing support for scale change, measurement
averaging and filtering, and alert pin configuration (threshold,
hysteris, tamper).
Signed-off-by: Aurelien Jarno <aurelien@aurel32.net>
Move to CMake 3.20.0.
At the Toolchain WG it was decided to move to CMake 3.20.0.
The main reason for increasing CMake version is better toolchain
support.
Better toolchain support is added in the following CMake versions:
- armclang, CMake 3.15
- Intel oneAPI, CMake 3.20
- IAR, CMake 3.15 and 3.20
Signed-off-by: Torsten Rasmussen <Torsten.Rasmussen@nordicsemi.no>
I can't find any reference anywhere showing that the manufacturer of
the LPD8803 or LPD8806 LED scripts is a company called 'colorway'.
Use 'greeled' instead; these seem to actually be manufactured by
GreeLed corporation.
Signed-off-by: Martí Bolívar <marti.bolivar@nordicsemi.no>
It should be "maxim,max30101", because the vendor prefix for this
company is "maxim", not "max".
Signed-off-by: Martí Bolívar <marti.bolivar@nordicsemi.no>
This driver supports the TI INA230 and INA231 Bidirectional Current
and Power Monitors. The devices work on the I2C interface and are
created from DT nodes with a compatible property matching "ti,ina23x".
The following datasheets were referenced while developing the driver:
https://www.ti.com/product/INA230https://www.ti.com/product/INA231
Twister passed:
twister -T tests/drivers/build_all/sensor/
Testing was performed on the stm32g071b_disco board with the following:
Load: ~170 ohms
Voltage: 5V
Measured Values:
Voltage: 5.1 V
Current: 0.032 A
Power: 0.157 W
Signed-off-by: Sam Hurst <sbh1187@gmail.com>
Some devices compatibles with the WS2812 IC have a different channel to
color mappings (e.g. RGB, BGR, RGBW, etc).
This patch introduces the "color-mapping" required property for the
WS2812 DT binding and adds support to the ws2812_gpio and ws2812_spi
drivers. This new property allows to configure the color to channel
mapping of a WS2812 compatible LED strip controller from its DT node.
Since this property also allows to know if a white channel is available,
then this patch removes the "has-white-channel" property.
Signed-off-by: Simon Guinot <simon.guinot@seagate.com>
Enable serial driver such that sensors commuicating via uart
can be added to this test(using the vnd,serial driver).
Signed-off-by: Thomas Stranger <thomas.stranger@outlook.com>
Include the TI HDC2010, HDC2021, HDC2022 and HDC2080 temperature and
humidity sensors in the build_all test, to test the TI_HDC20XX driver.
Signed-off-by: Aurelien Jarno <aurelien@aurel32.net>
Now that we only build on native_posix, we can build all the sensors
together in one pass. This makes it easier to manage the conf files
going forward.
Signed-off-by: Kumar Gala <kumar.gala@linaro.org>
The driver build_all tests only need to build a driver once and
so limit the sensor tests to only build on native_posix.
We tweak CONFIG_SYS_CLOCK_TICKS_PER_SEC as part of this change as
hp206c requires this setting to build.
Signed-off-by: Kumar Gala <kumar.gala@linaro.org>
Add the I2C version of the MS5607 (the SPI version was already enabled)
so that it gets compiled tested.
Signed-off-by: Aurelien Jarno <aurelien@aurel32.net>
Enable building the LMP90xxx driver (move devicetree nodes over from the
sensors/spi.dtsi). Limit to building on a single platform as this
is just making sure the drivers compile.
Signed-off-by: Kumar Gala <kumar.gala@linaro.org>
